Imprint apparatus and article manufacturing method

ABSTRACT

The imprint apparatus of the present invention includes a holding unit configured to hold a mold; a particle inspection unit configured to inspect whether or not particle is present on an imprint area, in which the resin pattern is formed, of the substrate; a dispenser configured to apply an uncured resin to the imprint area; a movable unit configured to move the imprint area with respect to the holding unit; and a controller. The movable unit is capable of moving the imprint area to each of an inspection position by means of the inspection unit, an application position by means of the dispenser, and a contacting position by means of the holding unit. Also, the controller causes the inspection unit to perform inspection of the imprint area in association with the movement of the imprint area by means of the movable unit.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an imprint apparatus and an articlemanufacturing method using the same.

Description of the Related Art

As the demand for microfabrication of semiconductor devices increases,not only a conventional photolithography technology but also amicrofabrication technology in which a mold and an uncured resin on asubstrate are brought into contact with each other to thereby form aresin pattern, which corresponds to the fine concave and convex patternformed on the mold, on the substrate are present. This technology isalso referred to as an “imprint technology”, by which a fine structurewith dimensions of a few nanometers can be formed on the substrate. Oneexample of imprint technologies includes a photo-curing method. Thephoto-curing method first applies an ultraviolet curable resin (imprintresin) to the shot area (imprint area) on the substrate. Next, the resin(uncured resin) and a mold are pressed against each other. After theultraviolet curable resin is irradiated with ultraviolet light forcuring, the cured resin is released from the mold, whereby a resinpattern is formed on the substrate. As a method involving the imprinttechnology, Japanese Patent Laid-Open No. 2009-60084 discloses animprint method that removes a resin layer of an overflowed regionoverflowed from a processed region.

Here, in the conventional imprint method (apparatus) disclosed inJapanese Patent Laid-Open No. 2009-60084, if particle is present on animprint area, the particle may be entrapped when a mold is pressedagainst a resin, resulting in a damage of the concave and convex patternformed on the mold.

SUMMARY OF THE INVENTION

Accordingly, the present invention provides an imprint apparatus thatefficiently detects particle present on an imprint area while limitingreductions in productivity.

According to an aspect of the present invention, an imprint apparatusthat forms a pattern by bringing an uncured resin applied to a substrateinto contact with a pattern surface of a mold is provided that includesa holding unit configured to hold the mold; a particle inspection unitconfigured to inspect whether or not particle is present on an imprintarea, in which the resin pattern is formed, of the substrate; adispenser configured to apply the uncured resin to the imprint area; amovable unit configured to move the imprint area with respect to theholding unit; and a controller configured to control the operation ofthe holding unit, the particle inspection unit, the dispenser, and themovable unit, wherein the movable unit is capable of moving the imprintarea to each of an inspection position by means of the particleinspection unit, an application position by means of the dispenser, anda contacting position by means of the holding unit, and the controllercauses the particle inspection unit to perform inspection of the imprintarea in association with the movement of the imprint area by means ofthe movable unit.

According to the present invention, an imprint apparatus thatefficiently detects particle present on an imprint area while limiting areduction in productivity may be provided.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating the configuration of an imprintapparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic view illustrating a conventional particleinspection unit.

FIG. 3 is a flowchart illustrating an imprinting step according to afirst embodiment.

FIG. 4A is a schematic view illustrating the movement of the componentsin step S101 shown in FIG. 3.

FIG. 4B is a schematic view illustrating the movement of the componentsin step S102 shown in FIG. 3.

FIG. 4C is a schematic view illustrating the movement of the componentsin step S104 shown in FIG. 3.

FIG. 5 is a schematic view illustrating the configuration of an imprintapparatus according to a second embodiment.

FIG. 6 is a flowchart illustrating an imprinting step according to asecond embodiment.

FIG. 7A is a schematic view illustrating the movement of the componentsin step S201 shown in FIG. 6.

FIG. 7B is a schematic view illustrating the movement of the componentsin step S202 shown in FIG. 6.

FIG. 7C is a schematic view illustrating the movement of the componentsin step S204 shown in FIG. 6.

FIG. 7D is a schematic view illustrating the movement of the componentsin step S206 shown in FIG. 6.

FIG. 8 is a schematic view illustrating how a resin is applied to eachshot according to a fourth embodiment.

FIG. 9 is a schematic view illustrating the layout of shots on a waferaccording to the fourth embodiment.

FIG. 10 is a flowchart illustrating an imprinting step according to afourth embodiment.

FIG. 11A is a plan view illustrating the configuration of an imprintapparatus according to a fifth embodiment when the measurement range ofa particle inspection unit is set so as to be extended along the Y-axisdirection.

FIG. 11B is a plan view illustrating the configuration of an imprintapparatus according to a fifth embodiment when the measurement range ofa particle inspection unit is set so as to be extended along the X-axisdirection.

FIG. 11C is a plan view illustrating the movement of a mold holdingdevice and a particle inspection unit when the configuration shown inFIG. 11A is employed.

DESCRIPTION OF THE EMBODIMENTS First Embodiment

Firstly, a description will be given of the configuration of an imprintapparatus according to a first embodiment of the present invention. FIG.1 is a schematic view illustrating the configuration of the imprintapparatus of the present embodiment. The imprint apparatus is aprocessing apparatus that transfers the concave and convex pattern of amold onto a wafer (a substrate), i.e., a treatment object substrate,which is used in a semiconductor device manufacturing process, and is anapparatus that employs a photo-curing method used in imprinttechnologies. In the following drawings, a description will be givenwhere the Z axis (vertical direction) is aligned parallel to theirradiation axis of ultraviolet light for a mold, the X axis (horizontaldirection) is aligned in the direction in which a wafer stage moves onthe basis of a mold holding device to be described below in a planeperpendicular to the Z axis, and the Y axis is aligned in the directionperpendicular to the X axis. Firstly, an imprint apparatus 1 of thepresent invention includes an illumination unit 2, a mold holding device4, a wafer stage 6, a dispenser 7, a particle inspection unit 8, and acontroller 9.

The illumination unit 2 is a unit configured to irradiate the mold 3with ultraviolet light during imprint processing. The illumination unit2 is constituted by a light source (not shown) and a plurality ofoptical elements that adjust ultraviolet light 10 emitted from the lightsource to a light suitable for imprinting. The mold 3 is a member inwhich a predetermined concave and convex pattern (e.g., circuit pattern)is three-dimensionally formed on a side facing a wafer 5. The surface ofthe concave and convex pattern is processed at high flatness so as tomaintain the adhesion between the wafer 5 and the surface. The materialof the mold 3 is a material such as quartz or the like through whichultraviolet light can pass.

The mold holding device 4 is a holding unit (contacting unit) configuredto hold the mold 3 and press (bring) the pattern surface of the mold 3against (into contact with) an ultraviolet curable resin applied to thewafer 5. The mold holding device 4 includes a mold base (holding unit)11 for drawing and holding the mold 3 using suction force orelectrostatic force, and a base driving mechanism (not shown) fordriving the mold base 11. The base driving mechanism is a driving systemthat drives the mold base 11 in the Z-axis direction so as to perform acontacting operation. An actuator employed for the driving mechanism isnot particularly limited. A linear motor, an air cylinder, and the likemay be employed. In the imprint apparatus 1 of the present embodiment,the mold 3 is pressed against an ultraviolet curable resin on the fixedwafer 5. In contrast, an ultraviolet curable resin on the wafer 5 may bepressed against the fixed mold 3. In this case, a wafer stage 6 to bedescribed below is the contacting unit.

The wafer 5 is a treatment object substrate consisting of, for example,a single crystal silicon, and the ultraviolet curable resin (hereinafterreferred to simply as “resin”), which serves as a portion to be molded,is applied to the treatment surface. Also, the wafer stage 6 is asubstrate holding unit (movable unit) configured to hold (mount) thewafer 5 by vacuum suction and be freely moveable in the XY plane on themold holding device 4. The wafer stage 6 includes an auxiliary member(chuck) for directly holding the wafer 5, and an actuator for driving anassisting member (all of which are not shown). The wafer stage 6 alsoincludes a mechanism (not shown) that not only performs accuratepositioning for overlapping the pattern but also adjusts the attitude ofthe surface of the wafer 5. The wafer stage 6 is controlled by apositioning unit 12 in conjunction with the driving of the actuator.

The dispenser 7 is a unit configured to apply an ultraviolet curableresin to the wafer 5. In the present embodiment, two dispensers 7 areprovided at the positive side and the negative side on the X axis on thebasis of the mold holding device 4 in the moving direction of the waferstage 6. An ultraviolet curable resin is a photocurable resin (imprintresin) having the property of being cured by receiving irradiation ofultraviolet light, and is appropriately selected by the type ofsemiconductor device to be manufactured. Hereinafter, an ultravioletcurable resin is simply referred to as a “resin” and a resin that is inits uncured state prior to irradiation of ultraviolet light is referredto as an “uncured resin” for simplicity. Here, since a resin is highlyvolatile and is generally applied for one to several shots (imprintarea), the dispenser 7 is provided in proximity to the mold base 11 suchthat the movement distance of the wafer stage 6 is made as short as muchas possible. While the number of the dispensers 7 installed is plural asshown in FIG. 1 in order to improve the productivity of devices, atleast one dispenser 7 may be provided as long as the productivity issufficiently satisfied.

The particle inspection unit 8 is a unit configured to inspect whetheror not particle is present (attached) on the wafer 5. The particleinspection unit 8 includes an illumination system that illuminates lighttowards the shot on the wafer 5, and a detection system that receivesscattered light from the shot (none of which are shown). Also, theparticle inspection unit 8 is provided at two locations between the moldholding device 4 and the dispensers 7 one each at a positive side and anegative side on the X axis on the basis of the mold holding device 4 inthe moving direction of the wafer stage 6. Note that the effect of theparticle inspection performed by the particle inspection unit 8 will bedescribed below. The configuration of the particle inspection unit 8 isnot limited thereto. For example, an imaging unit that performs particleinspection by photographing a shot using a CCD sensor or the like isalso applicable.

The controller 9 is a unit configured to control the operation,adjustment, and the like of the components of the imprint apparatus 1.The controller 9 is constituted by a computer having a storage unit suchas a magnetic storage medium or the like, a sequencer, or the like thatis connected to the components of the imprint apparatus 1 through aline, and executes control of the components by a program or a sequence.Note that the controller 9 may be integrated with the imprint apparatus1, or may be installed at a location separate from the location wherethe imprint apparatus 1 is installed to thereby be controlled remotely.

Next, a description will be given of an imprint method including aparticle inspection step of detecting particle present on an imprintarea on the wafer 5 using the particle inspection unit 8, which is afeature of the present embodiment. FIG. 2 is a schematic viewillustrating a conventional particle inspection unit 60. The particleinspection unit 60 includes an illumination system 62 that illuminateslight towards the shot on the wafer 61, and a detection system 63 thatreceives scattered light from the shot. Here, when the illuminationsystem 62 illuminates light and no particle is present on the shot,incident light that is incident to the shot is specularly-reflected onthe surface of the wafer 61. Hence, the detection system 63 does notreceive reflected light. In contrast, when the particle 64 is present onthe shot as shown in FIG. 2, incident light is scattered by the particle64, and thus, light is reflected at angles other than the specularangle. Thus, the detection system 63 detects the particle 64 byreceiving the scattered light. Note that a particle inspection unit maydetermine the presence/absence of particle using the differences bycomparing the images or signals for a plurality of shots. In the imprintapparatus 1 of the present embodiment, the particle inspection unit 8preferably performs particle inspection for each shot in associationwith the movement of the wafer stage 6 between a contacting step and anapplication step. With this arrangement, the inspection time can bereduced compared with the case where particle inspection is performed onthe entire surface of the wafer 61 prior to the contacting step ofpressing the mold against the resin on the wafer 61. Since the timerequired between the particle inspection step and the contacting stepcan also be reduced, the possibility that new particle may becomeattached to the wafer 61 may be reduced.

FIG. 3 is a flowchart illustrating the flow of the imprinting step ofthe present embodiment. Each of FIGS. 4A to 4C is a schematic viewillustrating the movement of the components in the imprint apparatus 1corresponding to each of the steps in the imprinting step shown in FIG.3. Here, the controller 9 executes a second imprinting step for a nextshot (a second shot 15) on the wafer 5 on which a first imprinting step(step S100) for the previous shot (first shot) has been completed. Inthis case, in order to apply a resin to the second shot 15, thecontroller 9 firstly drives the wafer stage 6 from the positive side tothe negative side in the X-axis direction such that the second shot 15is positioned at the application position of a first dispenser 7 a asshown in FIG. 4A (step S101). At this time, as shown in FIG. 4B, thesecond shot 15 passes through the inspection position of a firstparticle inspection unit 8 a that is located between the mold 3 and thefirst dispenser 7 a. Thus, the controller 9 causes the first particleinspection unit 8 a to perform particle inspection on the surface of thesecond shot 15 (particle inspection step: step S102). Here, thecontroller 9 determines whether or not particle is present on thesurface of the second shot 15 based on the inspection result obtained bythe first particle inspection unit 8 a (step S103). When the controller9 determines in step S103 that no particle is present (No), thecontroller 9 continues the driving of the wafer stage 6 as it is asshown in FIG. 4C, and causes the second shot 15 to be positioned at theapplication position of the first dispenser 7 a to thereby apply a resinto the second shot 15 (application step: step S104). Next, thecontroller 9 drives the wafer stage 6 from the negative side to thepositive side in the X-axis direction such that the second shot 15 ispositioned at the contacting position of the mold 3 (step S105). Then,the controller 9 executes the contacting step for the second shot 15.After the resin is irradiated with ultraviolet light for curing (curingstep), the controller 9 executes a releasing step (step S106), and thus,the second imprinting step is ended (step S107).

On the other hand, when the controller 9 determines in step S103 thatparticle is present on the surface of the second shot 15 (Yes), thecontroller 9 proceeds to a bypass step of bypassing the normalapplication and contacting steps (step S108). In the bypass step, forexample, the controller 9 ends the second imprinting step withoutperforming the application and contacting steps subject to the secondshot 15. With this arrangement, the imprint operation can be avoidedwhile particle is present on the surface of the wafer 5, which preventsthe concave and convex pattern formed on the mold 3 from being broken.

In the bypass step in step S108, the controller 9 may execute only theapplication step for the second shot 15. In other words, inconsideration of post-steps such as an etching step or the like includedin the manufacturing process of a semiconductor device, the differencebetween the structure of the second shot 15 and that of another shotsubjected to the imprinting step normally occurs when the imprintingstep is not subject only to the second shot 15 on which particle ispresent. Thus, in the bypass step, the controller 9 may decrease thedifference by executing only the application step of applying a resin toone surface of the second shot 15. Furthermore, in the bypass step, thecontroller 9 may stop all of the post-imprinting steps. In this case,the controller 9 temporarily stops all of the imprinting steps, andspecifies the cause of the attachment of particle to remove the cause,whereby the controller 9 can newly perform the imprinting step.

The imprint apparatus 1 of the present embodiment sequentially performsthe imprinting step shown in FIG. 3 to a plurality of shots alternatelyusing a pair of the first dispenser 7 a and the first particleinspection unit 8 a, and the other pair of a second dispenser 7 b and asecond particle inspection unit 8 b opposing thereto. In other words, inthe second imprinting step for the second shot 15, the wafer stage 6 ismoved from the negative side to the positive side in the X-axisdirection when the process transfers to the contacting step in stepS106. Thus, when the imprinting step is performed on the next third shot(not shown), the controller 9 moves the wafer stage 6 as it is from thenegative side to the positive side in the X-axis direction, and executesa third imprinting step using the second dispenser 7 b and the secondparticle inspection unit 8 b. With this arrangement, the imprintapparatus 1 performs the imprinting step individually for a plurality ofshots in parallel with the moving direction of the wafer stage 6,resulting in no reduction in productivity.

As described above, according to the imprint apparatus 1 of the presentembodiment, particle present on an imprint area may be efficientlydetected while limiting a reduction in productivity.

Second Embodiment

Next, a description will be given of an imprint apparatus according to asecond embodiment of the present invention. FIG. 5 is a schematic viewillustrating the configuration of an imprint apparatus 20 of the presentembodiment. In FIG. 5, the same elements as those in the imprintapparatus 1 shown in FIG. 1 are designated by the same referencenumerals and explanation thereof will be omitted. While, in the firstembodiment, the particle inspection unit 8 and the dispenser 7 aresequentially arranged from the mold holding device 4, a feature of theimprint apparatus 20 lies in the fact that a dispenser 21 and a particleinspection unit 22 are sequentially arranged from the mold holdingdevice 4.

FIG. 6 is a flowchart illustrating the flow of the imprinting step ofthe present embodiment. Each of FIGS. 7A to 7D is a schematic viewillustrating the movement of the components in the imprint apparatus 20corresponding to the steps in the imprinting step shown in FIG. 6. Also,in this case, the controller 9 executes the second imprinting step for anext shot (a second shot 25) on the wafer 5 on which the firstimprinting step (step S200) for the previous shot (first shot) has beencompleted. In order to apply a resin to the second shot 25, thecontroller 9 first drives the wafer stage 6 from the positive side tothe negative side in the X-axis direction towards the applicationposition of a first dispenser 21 a as shown in FIG. 7A (step S201).Here, the controller 9 moves the wafer stage 6 as it is even when thesecond shot 25 is positioned at the application position of the firstdispenser 21 a as shown in FIG. 7B. Then, the controller 9 causes thesecond shot 25 to pass through the inspection position of a firstparticle inspection unit 22 a that is arranged ahead of the firstdispenser 21 a, and causes the first particle inspection unit 22 a toperform first particle inspection on the surface of the second shot 25(first particle inspection step: step S202). Here, the controller 9determines whether or not particle is present on the surface of thesecond shot 25 based on the first inspection result obtained by thefirst particle inspection unit 22 a (step S203). When the controller 9determines in step S203 that no particle is present (No), the controller9 drives the wafer stage 6 from the negative side to the positive sidein the X-axis direction as shown in FIG. 7C as opposed to the earliermoving direction. Then, the controller 9 causes the second shot 25 topass through the inspection position of the first particle inspectionunit 22 a that is arranged ahead of the first dispenser 21 a, and causesthe first particle inspection unit 22 a to perform second particleinspection on the surface of the second shot 25 (second particleinspection step: step S204). Here, the controller 9 determines whetheror not particle is present on the surface of the second shot 25 based onthe second inspection result obtained by the first particle inspectionunit 22 a (step S205). When the controller 9 determines in step S205that no particle is present (No), the controller 9 continues the drivingof the wafer stage 6 as it is as shown in FIG. 7D, and causes the secondshot 25 to be positioned at the application position of the firstdispenser 21 a to thereby apply a resin on the second shot 25(application step: step S206). Next, the controller 9 drives the waferstage 6 as it is such that the second shot 25 is positioned at thecontacting position of the mold 3 (step S207). Then, the controller 9executes the contacting step for the second shot 25. After the resin isirradiated with ultraviolet light for curing, the controller 9 executesthe releasing step (step S208), and thus, the second imprinting step isended (step S209).

On the other hand, when the controller 9 determines in any one of stepsS203 and S205 that particle is present on the surface of the second shot25 (Yes), the controller 9 proceeds to a bypass step of bypassing thenormal application and contacting step (step S210). The bypass step isthe same as that in step S108 according to the first embodiment. Theimprint apparatus 20 of the present embodiment also sequentiallyperforms the imprinting step shown in FIGS. 6 and 7A to 7D to aplurality of shots alternately using the dispensers 21 and the particleinspection units 22 as in the first embodiment.

As described above, since the imprint apparatus 20 of the presentembodiment provides the same effect as that in the first embodiment andthe particle inspection unit 22 performs particle inspection two timesfor the same shot during one imprinting step, the accuracy of particleinspection performed by the particle inspection unit 22 can be improved.

In the present embodiment, particle inspection is performed two times bythe particle inspection unit 22 during acceleration/deceleration of thewafer stage 6, and thus, the inspection result requires carefulevaluation. In other words, assuming that the particle inspection unit22 measures particle having the same particle diameter for the sameperiod of time, the amount of scattered light received by the particleinspection unit 22 is small when the traveling speed of the wafer stage6 is fast, whereas the amount of scattered light received thereby islarge when the traveling speed thereof is slow. Thus, the controller 9outputs the determination result relating to the presence/absence ofparticle taking into account the correction value corresponding to thetraveling speed of the wafer stage 6. It should be noted that theinstallation position of the particle inspection unit 22 according tothe present embodiment is located at the return point of transfer of thewafer stage 6. With this arrangement, the traveling speed of the waferstage 6 is temporarily reduced, which is advantageous for performingparticle inspection with high accuracy.

Third Embodiment

Next, a description will be given of an imprint apparatus according to athird embodiment of the present invention. A feature of the imprintapparatus of the present embodiment lies in the fact that the particleinspection unit 8 (22) shown in the embodiment is movable in parallel tothe moving direction of the wafer stage 6 in accordance with the movingdirection. In recent years, the traveling speed of the wafer stage 6 hasbeen improved to achieve further improvement in productivity. Thus,since the traveling speed of the wafer 5 upon passing through itsdetection position is too fast, particle may be undetectable or thedetection accuracy may be degraded if the particle inspection unit 8remains fixed. Accordingly, in the present embodiment, the particleinspection unit 8 is synchronized with the movement of the wafer stage6, and is moved in parallel at the same timing as the movement of thewafer stage 6 at a velocity different from that of the wafer stage 6 sothat the relative speed between the two is reduced. With thisarrangement, the accuracy of particle inspection performed by theparticle inspection unit 8 can be improved.

Fourth Embodiment

Next, a description will be given of an imprint apparatus according to afourth embodiment of the present invention. FIG. 8 is a schematic viewillustrating how a resin is applied to each shot using the imprintapparatus of the present embodiment. In FIG. 8, the reference symbolsassigned to the shots on the wafer 5 correspond to the shots shown inFIG. 9 to be described below, respectively. On the surface of each shot,a shot with no description is indicative of an “untreated shot”, a shotwith black circles is indicative of a “resin-applied shot”, and a shotwith black triangles is indicative of an “imprinted shot”. For thepurpose of illustration, the configuration of the imprint apparatusshown in FIG. 8 is the same as that of the imprint apparatus 20according to the second embodiment, but may also be the same as that ofthe imprint apparatus 1 of the first embodiment. FIG. 9 is a schematicview illustrating the layout of shots on the wafer 5. In the presentembodiment, as shown in FIG. 9, it is assumed that the wafer 5 isdivided into left and right areas that are aligned with the movementdirection of the wafer stage 6 starting from the shot that is positionedat the substantial center of the wafer 5. Then, a row of a plurality ofshots arranged in a first region L on the left side are set to S_(A),S_(B), and S_(C) in the order from the outer periphery of the wafer 5,whereas the same row of a plurality of shots arranged in a second regionR on the right side are set to S_(A)′, S_(B)′, and S_(C)′ in the orderfrom the inner periphery of the wafer 5. In consideration of this, afeature of the imprint apparatus of the present embodiment lies in thefact that another shot is subject to a particle inspection step whileone shot is subject to an imprinting step (contacting step, curing step,and releasing step).

FIG. 10 is a flowchart illustrating the flow of the imprinting step ofthe present embodiment. Firstly, the controller 9 executes a contactingstep for a shot (first imprint area) S_(A)′ on which a resin has alreadybeen applied (step S301A). At this time, the controller 9 executes aparticle inspection on the surface of the shot S_(A) using the firstparticle inspection unit 22 a in parallel with the contacting step forthe shot S_(A)′ as shown in the top view in FIG. 8 (step S301B). Next,the controller 9 drives the wafer stage 6 from the negative side to thepositive side in the X-axis direction, and causes the first dispenser 21a to apply a resin to the shot S_(A) for which a particle inspection hasbeen completed (step S302B). Next, the controller 9 drives the waferstage 6 again from the negative side to the positive side in the X-axisdirection so as to align the shot S_(A) with the contacting position,and executes a contacting step for the shot S_(A) (step S303A). At thistime, as shown in the bottom view shown in FIG. 8, the controller 9executes a particle inspection on the surface of the shot S_(B)′ using asecond particle inspection unit 22 b parallel to the contacting step forthe shot S_(A) (step S303C). Next, the controller 9 drives the waferstage 6 from the positive side to the negative side in the X-axisdirection, and causes a second dispenser 21 b to apply a resin to theshot S_(B)′ for which a particle inspection has been completed (stepS304C). Next, the controller 9 drives the wafer stage 6 again from thepositive side to the negative side in the X-axis direction so as toalign the shot S_(B)′ with the contacting position, and executes acontacting step for the shot S_(B)′ (step S305A). Hereinafter, thecontroller 9 repeats step S305B, step S306B, and the aforementionedimprinting step in accordance with the desired number of shots. In thepresent embodiment, it is desirable that the particle inspection units22 a and 22 b perform particle inspection while moving in parallel insynchronization with the movement of the wafer stage 6 as in the thirdembodiment. For example, some shots may not be subject to a particleinspection in the imprinting step due to the size of the mold holdingdevice 4 (the mold base 11) and the relative positions between the mold3 and the dispenser 21 and the particle inspection unit 22. However,since the number of such shots is sufficiently smaller than the numberof all shots, such shots may be inspected by performing a particleinspection in advance separately from the imprinting step.

As described above, since the imprint apparatus of the presentembodiment performs a particle inspection step for another untreatedshot while performing an imprinting step for one shot. In the imprintingstep in this case, that is, in the step in which the pattern surface ofthe mold 3 is in contact with a resin, the wafer stage 6 is stopped.However, when repeating the imprinting step for a plurality of shots asa series of operations, the particle inspection step of the presentembodiment is also performed in association with the movement of thewafer stage 6. Thus, the effect of the embodiment is advantageous forfurther improvement in productivity.

Fifth Embodiment

Next, a description will be given of an imprint apparatus according to afifth embodiment of the present invention. Each of FIGS. 11A to 11C is aschematic view illustrating the configuration of an imprint apparatus 30of the present embodiment. In particular, FIG. 11A and FIG. 11B are planviews illustrating the imprint apparatus 30 viewed from the top alongthe Z-axis direction. In the aforementioned embodiments, a dispenser anda particle inspection unit are disposed coaxially with the movingdirection of the wafer stage 6 on the basis of the mold holding device4. In contrast, a feature of the imprint apparatus 30 of the presentembodiment lies in the fact that a dispenser 31 is disposed on the Xaxis coaxially with the moving direction of the wafer stage 6, whereas aparticle inspection unit 32 is disposed on the Y axis perpendicular tothe moving direction of the wafer stage 6 on the basis of the moldholding device 4. The other aspects of the configuration of the imprintapparatus 30 are the same as those of the imprint apparatus 1 in thefirst embodiment and are designated by the same reference numerals andexplanation thereof will be omitted.

Here, while the particle inspection unit 32 a and 32 b, which aredisposed at two locations, generally move as a unitary block(synchronously) with the mold holding device 4, the particle inspectionunit 32 a and 32 b may also be movable as a single unit in the movingdirection (the X-axis direction) and in the direction (the Y-axisdirection) perpendicular to the moving direction separately from thesynchronous movement. As shown in FIG. 11A and FIG. 11B, the measurementrange (measurement length) of the particle inspection unit 32 may bechanged as appropriate. In other words, if the measurement range of theparticle inspection unit 32 is set to be elongated along the Y-axisdirection as shown in FIG. 11A, such configuration is efficient forperforming a scan-measurement in the X-axis direction. In this case, themovement of the particle inspection unit 32 in the Y-axis direction asappropriate allows the rows of a shot to be inspected to be changed soas to optimize the inspection rows in association with the layout of theshot. On the other hand, if the measurement range of the particleinspection unit 32 is set so as to be elongated along the X-axisdirection as shown in FIG. 11B, such configuration is efficient forperforming a scan-measurement in the Y-axis direction. Also, in thiscase, in the reverse to the description of FIG. 11A, the movement of theparticle inspection unit 32 in the X-axis direction as appropriateallows the inspection rows in association with the layout of the shot tobe optimized.

Next, a detailed description will be given of the movement of the moldholding device 4 and the particle inspection unit 32 with respect to thewafer 5 during a particle inspection. FIG. 11C is a plan viewillustrating the movement of the mold holding device 4 and the particleinspection unit 32. The configuration shown in FIG. 11A is employed forthe imprint apparatus 30. Here, it is assumed that the imprint apparatus30 is carrying out an imprinting step for a black-solid shot 33. At thistime, a relatively long period time is required for filling a resin intothe concave and convex pattern of the mold 3. Thus, two particleinspection units 32 a and 32 b perform a scan-measurement in the X-axisdirection for the time period so as to inspect whether or not particleis present on each inspection row of the shot. When the imprinting stephas been completed for one row of the shot 33, the imprint apparatus 30performs an imprinting step on another inspection row for which aparticle inspection has already been completed. For example, if themeasurement range of the particle inspection unit 32 is wide enough tocatch a plurality of rows, the particle inspection unit 32 may inspect aplurality of rows in a simultaneous manner. Also, if there is sufficientallowance of a resin filling time, the particle inspection unit 32 movesin the Y-axis direction, and changes the inspection row by itself so asto continue the particle inspection. As described above, since theimprint apparatus 30 of the present embodiment performs an imprintingstep and a particle inspection step in a parallel manner for a pluralityof rows on a shot, the effect of the embodiment is advantageous forfurther improvement in productivity.

Article Manufacturing Method

A method of manufacturing devices (a semiconductor integrated circuitelement, liquid crystal display element, and the like) as an articleincludes a process for transferring (forming) a pattern on a substrate(a wafer, glass plate, or film-like substrate) using the aforementionedimprint apparatus. Furthermore, the manufacturing method can include aprocess for etching the substrate on which the pattern is transferred.Note that upon manufacturing other articles such as patterned media(recording media) or optical elements, the manufacturing method caninclude other process for processing the substrate on which the patternis transferred in place of etching. The article manufacturing method ofthis embodiment has an advantage, as compared with a conventionalarticle manufacturing method, in at least one of performance, quality,productivity and production cost of an article.

While the embodiments of the present invention have been described withreference to exemplary embodiments, it is to be understood that theinvention is not limited to the disclosed exemplary embodiments. Thescope of the following claims is to be accorded the broadestinterpretation so as to encompass all such modifications and equivalentstructures and functions.

This application claims the benefit of Japanese Patent Applications No.2010-269468 filed Dec. 2, 2010 and No. 2011-255292 filed Nov. 22, 2011which are hereby incorporated by reference herein in its entirety.

1.-16. (canceled)
 17. An imprint apparatus that forms a pattern of animprint material on a substrate by using a mold, the imprint apparatuscomprising: a holding unit configured to hold the substrate on which afirst area and a second area different from the first area are provided;a dispenser configured to apply the imprint material to the substrate;and a particle inspection unit configured to inspect whether or not aparticle is present on the second area where the imprint material is notapplied while an imprinting step for the first area is performed. 18.The imprint apparatus according to claim 17, wherein the particleinspection unit determines there is the particle present on the secondarea, in a case where the particle inspection unit detects scatteredlight of light illuminated to the second area, the scattered light beingscattered by the particle on the second area.
 19. The imprint apparatusaccording to claim 17, wherein the particle inspection unit includes aCCD sensor and determines whether or not the particle is present on thesecond area based on the result of photographing.
 20. The imprintapparatus according to claim 17, wherein the second area is an area onwhich the pattern of the imprint material is to be formed after formingthe pattern of the imprint material on the first area.
 21. The imprintapparatus according to claim 17, wherein the imprint apparatus isconfigured to avoid forming the pattern of the imprint material on thesecond area, in the case where the particle inspection unit determinesthere is the particle on the second area.
 22. The imprint apparatusaccording to claim 17, wherein the imprint step includes: contacting themold and the imprint material applied to the first area; curing theimprint material; and releasing the mold from the cured imprintmaterial.
 23. The imprint apparatus according to claim 17, wherein thepattern of the imprint material is a pattern of a resin and thedispenser applies an uncured resin as the imprint material onto thesubstrate.
 24. An imprint method for forming a pattern of an imprintmaterial on a substrate on which a first area and a second areadifferent from the first area are provided, by using a mold, the imprintmethod comprising: applying the imprint material onto the first area;performing an imprint step for forming the pattern on the first area;and inspecting whether or not a particle is present on the second areawhere the imprint material is not applied while the imprinting step forthe first area is performed.
 25. The imprint method according to claim24, where the imprint step includes: contacting the mold and the imprintmaterial applied to the first area; curing the imprint material; andreleasing the mold from the cured imprint material.
 26. The imprintmethod according to claim 24, wherein the second area is an area onwhich the pattern of the imprint material is to be formed after formingthe pattern of the imprint material on the first area.
 27. The imprintmethod according to claim 24, wherein forming the pattern of the imprintmaterial on the second area is avoided in the case where the particleinspection unit determines there is the particle on the second area. 28.The imprint method according to claim 24, wherein the pattern of theimprint material is a pattern of a resin, and in applying, an uncuredresin as the imprint material is applied onto the first area.
 29. Amethod for manufacturing an article from a processed substrate, themethod comprising: forming a pattern of an imprint material on asubstrate with an imprint apparatus that forms the pattern on thesubstrate by using a mold; and processing the patterned substrate,wherein the imprint apparatus includes: a holding unit configured tohold the substrate on which a first area and a second area differentfrom the first area are provided; a dispenser configured to apply theimprint material to the substrate; and a particle inspection unitconfigured to inspect whether or not a particle is present on the secondarea where the imprint material is not applied while an imprinting stepfor the first area is performed.